Printed Circuit Board Layout
Capabilities:  
  •  Pre-layout Signal Integrity Analysis
  •  High-Speed Digital, Analog, RF & Mixed Signal Designs
  •  High-Layer Count Boards – ( 25+ Layers )
  •  High-Density PCBs – ( >500 pins per/inch )
  •  Fine Pitch BGA
  •  High-Pin Count BGA
  •  Flex PCB & Rigid-Flex PCB
  •  High-Speed Serial Backplanes
  •  High-Speed Interconnects:
     ( PCI, PCIX, PCIe, SAS, SATA, XAUI, XFP, SFP+, Serdes, etc.. )
  •  DDR2, DDR3 Memory Designs
  •  Hand-routing & Auto-routing Experts
  •  DFM / DFT
  •  Full PCB Library Management

CAD Tools:
  •  Cadence Allegro
  •  Mentor Expedition
  •  BoardStation
  •  Pads PowerPCB
  •  Altium
  •  Zuken      
  •  Orcad

Our Team:
  •  14 CAD Designers
    -  11 Degreed Engineers (BSEE)
    -  Can Scale For Peak Requirements
  •  Years of Experience
    -  CAD Managers – 30+ years
    -  Team Leaders – 15+ years
    -  Designers – 10+ years
  •  Contractor Roster
    -  Over 100 Designers Nationwide
    -  Virtually All CAD Platforms
High-Speed PCB Layout Example:

13.7" x 21.5"
24 Layers
18,375 Components
60,216 Connections
11,469 Nets
58,103 Vias
Back-drilled Vias
Interfaces: XFI @ 10Gbs,
Xaui @6.25Gbs, PCIe, SGMII, DDR3
Our Engineers
Helped These  
Companies Succeed

Agilent
Alcatel-Lucent
Altera
Amphenol
Boeing
Ciena
Cisco
EDO/RSS
Extreme Networks
Force 10 Networks
Foundry Networks
General Dynamics
Google
IBM
Intel
ITT
IXIA
Juniper Networks
Lattice
LGC Wireless
Lockheed
LSI Logic
McAfee
Motorola
Nokia
Nortel
Nvidia
Occam Networks
Pavad Medical
PICMG
Qualcomm
Raytheon
Spirent
Sun MicroSystems
Tellabs
Texas Instruments
ThermoFisher
Vita
Vitesse
Xilinx
Zonare Medical