Printed Circuit Board Layout
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Capabilities:
- Pre-layout Signal Integrity Analysis
- High-Speed Digital, Analog, RF & Mixed Signal Designs
- High-Layer Count Boards – ( 25+ Layers )
- High-Density PCBs – ( >500 pins per/inch )
- Fine Pitch BGA
- High-Pin Count BGA
- Flex PCB & Rigid-Flex PCB
- High-Speed Serial Backplanes
- High-Speed Interconnects:
( PCI, PCIX, PCIe, SAS, SATA, XAUI, XFP, SFP+, Serdes, etc.. )
- DDR2, DDR3 Memory Designs
- Hand-routing & Auto-routing Experts
- DFM / DFT
- Full PCB Library Management
CAD Tools:
- Cadence Allegro
- Mentor Expedition
- BoardStation
- Pads PowerPCB
- Altium
- Zuken
- Orcad
Our Team:
- 11 Degreed Engineers (BSEE)
- Can Scale For Peak Requirements
- CAD Managers – 30+ years
- Team Leaders – 15+ years
- Designers – 10+ years
- Over 100 Designers Nationwide
- Virtually All CAD Platforms



High-Speed PCB Layout Example:
13.7" x 21.5"
24 Layers
18,375 Components
60,216 Connections
11,469 Nets
58,103 Vias
Back-drilled Vias
Interfaces: XFI @ 10Gbs,
Xaui @6.25Gbs, PCIe, SGMII, DDR3
Our Engineers Helped These Companies Succeed
Agilent Alcatel-Lucent Altera Amphenol Boeing Ciena Cisco EDO/RSS Extreme Networks Force 10 Networks Foundry Networks General Dynamics Google IBM Intel ITT IXIA Juniper Networks Lattice LGC Wireless Lockheed LSI Logic McAfee Motorola Nokia Nortel Nvidia Occam Networks Pavad Medical PICMG Qualcomm Raytheon Spirent Sun MicroSystems Tellabs Texas Instruments ThermoFisher Vita Vitesse Xilinx Zonare Medical
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